IBMMuseum
Veteran Member
- Joined
- Aug 28, 2006
- Messages
- 1,488
Looks like an appropriate posting location...
I've been harvesting parts from non-functional clone motherboards, and wonder about some of the nuances others may use:
Typically I localize the heatgun on the solder side, then rap the board down over a cardboard box. Excess solder splashes in thin coatings over the surface of the components, although it can usually be etched or wiped away. I might try over a bucket of water, in the hope that the solder drops would be separated from the components, hardening before it "splashed" on them.
Thoughts?...
I've been harvesting parts from non-functional clone motherboards, and wonder about some of the nuances others may use:
Typically I localize the heatgun on the solder side, then rap the board down over a cardboard box. Excess solder splashes in thin coatings over the surface of the components, although it can usually be etched or wiped away. I might try over a bucket of water, in the hope that the solder drops would be separated from the components, hardening before it "splashed" on them.
Thoughts?...